Our ultimate performance bundle featuring the HEATKILLER V cooling block and active backplate for the EVGA FTW3 combines all the knowledge and experience we have gained with the HEATKILLER V generation and puts it all together in one incredibly powerful and elegant package.
HEATKILLER V for EVGA FTW3 features
- Dual-layer flow path
- Refined cooling structure
- Improved flow rate
- Symmetrical design
- Screwless front cover
- Integrated aRGB
- Isolating standoffs made from high-performance plastic (PEEK)
- CNC cut thermal pads
- Kryonaut thermal paste integrated
By raising the number of cooling fins directly above the DIE, we improved the cooling per-formance in this most critical area. The cold plate is milled from a solid piece of 99% pure electrolytic copper and makes perfect contact to all relevant components. The innovative dual-layer flow path layout distributes the coolant on two parallel layers. This improves the flow rate of the HEATKILLER® V block by over 30% compared to its predecessor.
Symmetrical, wide flow channels reduce dead spots (standing liquid) to the absolute mini-mum and improve not only the flow rate, but also the cooling performance. newly developed standoffs made from an industrial-grade high-performance plastic (PEEK) isolate the massive 10mm copper block perfectly from the PCB.
With all the technical innovations also come new design choices. The screwless top makes the HEATKILLER® V look like it's made from one piece. The symmetrical flow channel layout gives the block an absolutely unique look and sets it off from any other water block. The versions with nickel-plated coldplate and acrylic top also come with integrated aRGB illumination to perfectly integrate the GPU block into an existing illumination concept.
The acclaimed Kryonaut thermal paste from Thermal Grizzly guarantees perfect contact between block and GPU die. CNC cut thermal pads provide cooling for RAM and voltage regulation. The pads can be easily removed without tearing.
HEATKILLER V eBC-active Backplate Features
- Solid copper backplate
- Parallel flow
- Very easy mounting
- High-Luminous aRGB illumination
To cope with the extreme V-Ram temperatures of the current high-end graphics cards from NVIDIA, our active eBC backplate offers an enormous copper surface. Thanks to the uncompromising all-copper design, the backplate achieves absolute top values for VRAM hot-spot temperatures! The well designed arrangement of the cooling channels ensures an optimal flow through the copper Surface.
Parallel inflow increases the throughput while lowering the flow resistance. As a result, the construction requires less pump power for small systems and enhances the flow performance for large circuits. To maintain optimal GPU cooling performance, the flow ratio between the active backplate and the GPU cooler has been maximized.
In order to make the mounting as easy as possible, we decided to use a build-up installation. The cooler and the backplate are simply mounted in advance and connected to the terminal at the very end.
Material base plate: Electrolytic copper nickel-plated
Material cover: PLEXIGLAS® GS
Material cover: black anodized aluminum
Material connection terminal: Acetal
Dimensions: (LxWxH): 292.5 x 146.9 x 40.5mm (43.5 incl. terminal)
Connection: 4x G ¼ inch (DIN ISO 228-1)
Approved up to 1 bar
EVGA Geforce RTX 3080 FTW3
EVGA Geforce RTX 3080Ti FTW3
EVGA Geforce RTX 3090 FTW3
See also http://gpu.watercool.de for more details
Scope of delivery:
1x HEATKILLER® V incl. active backplate.
HEATKILLER® LED Strip aRGB
Thermal Grizzly Kryonaut thermal compound