For demanding cooling applications, the HeatPhase Ultra PTM Pad from Gelid offers the perfect balance of high performance and durability. The innovative phase-change material remains solid at room temperature and only develops its special properties at high temperatures: it liquefies, spreads optimally due to its low viscosity - and returns to a solid state in a controlled manner when it cools down. The result: Minimised pump-out effect with maximum reliability.
The HeatPhase Ultra PTM Pad shows its strength particularly with copper coolers for processors (CPU, GPU). While conventional thermal pastes can be pushed out by temperature fluctuations, the HeatPhase Ultra PTM Pad remains stable and effective thanks to its active recovery.
After several heat cycles above 60 °C, the material develops its full conductivity. It is more durable than standard pastes, making it the ideal solution for anyone who requires more performance with less maintenance.
Key points of the HeadPhase Ultra PTM pad:
- Outstanding performance
- Easy to use
- Non-electroconductive
- Durable
The HeatPhase Ultra PTM Pad can also be easily cut to size for installation on graphics card processors, for example.
Technical data:
Dimensions: 40 x 30 x 0.2mm AMD version
Operating temperature: -50 - 125°C
Phase transition temperature: 45°C
Delivery contents:
1 HeatPhase Ultra PTM Pad for AMD
Product safety information
Manufacturer information:
GELID Solutions
11 Yip Hing Street,
Wong Chuk Hang
Hong Kong, Hongkong,
Responsible person:
Watercool GmbH
Zum Mevenbruch 6
Mecklenburg-Vorpommern
Waren, Deutschland, 17192
support@watercool.de
| Item information |
Value |
| Shipping weight: |
0,01 kg
|
There are no reviews yet.
